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Hybrid EM Modeling Intern: 3D SI/PI for Interconnects
Posted by Intel Corporation • June 04, 2026
Description
Intel Corporation in Guadalajara, Mexico seeks a motivated Electromagnetic Modeling Student Worker. This position focuses on building and validating 3D electromagnetic models for high-speed interconnects using tools like Ansys HFSS and CST Microwave Studio. Candidates should be pursuing a degree in a related technical field, possess a strong understanding of signal integrity, and have experience with scripting. The role offers valuable exposure to EM simulation and collaboration within a dynamic engineering team.
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