Senior ASIC Design Engineer, Low Power Audio AI Subsystems
Posted by Qualcomm • June 04, 2026
Description
Company
Qualcomm Canada ULC
Job Area
Engineering Group, Engineering Group > ASICS Engineering
General Summary
What we are doing has not been done. Shape the future of low power AI subsystems. Push the boundaries on features and performance. Qualcomm Technologies Audio products are designed to offer premium wireless connectivity, high levels of integration, immersive sound quality, and on-device AI for smart audio and context aware applications. An ultra‑low power subsystem within a low power SoC; a chip‑within‑a‑chip HW block incorporating multiple always‑on IP's, design execution within this group requires solving ground‑breaking challenges and multiple power domain crossing issues. As we deliver to the premium tiers of the mobile, compute, automotive, and IoT markets, we strive to pioneer new and/or improved functionality and innovate to minimize power consumption. Make a difference, join a team on the cutting edge and become an integral...
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